In the process of SMT chip processing, whether the solder paste on the pad is not full or the solder paste remains too much, it is a bad phenomenon. It is necessary to analyze the cause of the problem and make a reasonable and effective solution. So why is there not enough solder on the solder joints in the SMT chip processing? The senior technicians below will analyze them carefully.
1. Problems from solder paste
For example: the flux used in solder paste is not active or wet, and the oxidized material at the soldering site cannot be completely removed. It is also possible that the solder paste is not sufficiently stirred before use and the tin powder is not fully fused. There is a possibility that the solder paste not be fill.
2. Problems from soldering
If the solder area itself has serious oxidation phenomenon, it is easy to show an paste insufficient after soldering; or the soldering position temperature is too low during reflow soldering; the solder paste is not enough.
In the SMT chip processing, there is a problem of insufficient soldering. Once the root cause of the problem is found out, it can be solved in a targeted manner.
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